Chip Quik Inc.
Chip Quik Inc. TS391SNL250
TS391SNL250
THERMALLY STABLE SOLDER PASTE NO
S$123.48
Product Details
| Form | Jar, 8.8 oz (250g) |
|---|---|
| Type | Solder Paste |
| Price | 1 : $107.37000 Bulk |
| Package | Bulk |
| Process | Lead Free |
| Flux Type | No-Clean |
| Mesh Type | 4 |
| Shelf Life | 12 Months |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) |
| Product Status | Active |
| Shelf Life Start | Date of Manufacture |
| Quantity Available | 82 In Stock |
| Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |