Chip Quik Inc.
Chip Quik Inc. TS391SNL250
TS391SNL250
THERMALLY STABLE SOLDER PASTE NO
Prices and stock are confirmed with the supplier at the moment you ask, so what you see is what you pay.
Product Details
| Form | Jar, 8.8 oz (250g) |
|---|---|
| Type | Solder Paste |
| Package | Bulk |
| Process | Lead Free |
| Flux Type | No-Clean |
| Mesh Type | 4 |
| Shelf Life | 12 Months |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) |
| Product Status | Active |
| Shelf Life Start | Date of Manufacture |
| Quantity Available | 82 In Stock |
| Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |