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Laird Technologies EMI

Laird Technologies EMI 67SLG030030050PI00

67SLG030030050PI00

RFI FILM OVER FOAM PU SOLDER

Prices and stock are confirmed with the supplier at the moment you ask, so what you see is what you pay.

Product Details

TypeFilm Over Foam
ShapeRectangle
Width0.118" (3.00mm)
Height0.118" (3.00mm)
Length0.197" (5.00mm)
SeriesSMD Grounding Metallized
PackageTape & Reel (TR) Cut Tape (CT) Digi-Reel®
MaterialPolyurethane Foam, Tin-Copper Polyester (SN/CU)
Product StatusActive
Attachment MethodSolder
Quantity Available15,933 In Stock
Operating Temperature-40°C ~ 70°C