Boyd Laconia, LLC
Boyd Laconia, LLC 374324B00035G
374324B00035G
HEATSINK BGA W/ADHESIVE TAPE
Prices and stock are confirmed with the supplier at the moment you ask, so what you see is what you pay.
Product Details
| Type | Board Level |
|---|---|
| Shape | Square, Pin Fins |
| Width | 1.063" (27.00mm) |
| Length | 1.063" (27.00mm) |
| Series | 37432 |
| Package | Box |
| Material | Aluminum |
| Fin Height | 0.394" (10.00mm) |
| Package Cooled | BGA, FPGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Quantity Available | 1,887 In Stock |
| Thermal Resistance @ Natural | 30.60°C/W |
| Power Dissipation @ Temperature Rise | 3.0W @ 90°C |
| Thermal Resistance @ Forced Air Flow | 9.30°C/W @ 200 LFM |