Chip Quik Inc.
Chip Quik Inc. PA0170-S
PA0170-S
MINI SOIC-8 EXP PAD STENCIL
Prices and stock are confirmed with the supplier at the moment you ask, so what you see is what you pay.
Product Details
| Type | Mini SOIC |
|---|---|
| Pitch | 0.026" (0.65mm) |
| Series | Proto-Advantage PA |
| Package | Bulk |
| Material | Stainless Steel |
| Product Status | Active |
| Inner Dimension | 0.118" L x 0.118" W (3.00mm x 3.00mm) |
| Outer Dimension | 1.300" L x 0.900" W (33.02mm x 22.86mm) |
| Quantity Available | 0 In Stock Check Lead Time |
| Thermal Center Pad | 0.315" L x 0.067" W (8.00mm x 1.70mm) |
| Number of Positions | 8 |