Molex
Molex 2045300471
2045300471
MLP 1.25W/B ST EMBOSSED PKG LOW
Prices and stock are confirmed with the supplier at the moment you ask, so what you see is what you pay.
Product Details
| Style | Board to Cable/Wire |
|---|---|
| Series | Micro-Lock PLUS 204530 |
| Package | Bulk |
| Features | Solder Retention |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Contact Type | Outer Shroud Contact |
| Contact Shape | Rectangular |
| Mounting Type | Surface Mount |
| Connector Type | Header |
| Fastening Type | Locking Ramp |
| Number of Rows | 1 |
| Pitch - Mating | 0.049" (1.25mm) |
| Product Status | Active |
| Voltage Rating | 50VAC/DC |
| Contact Material | Brass |
| Insulation Color | Black |
| Insulation Height | 0.165" (4.20mm) |
| Quantity Available | 0 In Stock Check Lead Time |
| Insulation Material | Polyamide (PA), Nylon, Glass Filled |
| Number of Positions | 4 |
| Contact Finish - Post | Tin-Bismuth |
| Current Rating (Amps) | 2.2A per Contact |
| Operating Temperature | -40°C ~ 105°C |
| Contact Finish - Mating | Tin-Bismuth |
| Number of Positions Loaded | All |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Mating | 39.4µin (1.00µm) |