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CTS Thermal Management Products

CTS Thermal Management Products BDN12-3CB/A01

BDN12-3CB/A01

HEATSINK CPU W/ADHESIVE 1.21"SQ

Prices and stock are confirmed with the supplier at the moment you ask, so what you see is what you pay.

Product Details

TypeTop Mount
ShapeSquare, Pin Fins
Width1.210" (30.73mm)
Length1.210" (30.73mm)
SeriesBDN
PackageTray
MaterialAluminum
Fin Height0.355" (9.02mm)
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Product StatusActive
Material FinishBlack Anodized
Attachment MethodThermal Tape, Adhesive (Included)
Quantity Available0 In Stock Check Lead Time
Thermal Resistance @ Natural19.60°C/W
Thermal Resistance @ Forced Air Flow6.80°C/W @ 400 LFM