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CTS Thermal Management Products

CTS Thermal Management Products BDN09-3CB

BDN09-3CB

HEATSINK CPU .91" SQ

Prices and stock are confirmed with the supplier at the moment you ask, so what you see is what you pay.

Product Details

TypeTop Mount
ShapeSquare, Pin Fins
Width0.910" (23.11mm)
Length0.910" (23.11mm)
SeriesBDN
PackageBox
MaterialAluminum
Fin Height0.355" (9.02mm)
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Product StatusActive
Material FinishBlack Anodized
Attachment MethodThermal Tape, Adhesive (Not Included)
Quantity Available211 In Stock
Thermal Resistance @ Natural26.90°C/W
Thermal Resistance @ Forced Air Flow9.60°C/W @ 400 LFM