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Wakefield Thermal Solutions

Wakefield Thermal Solutions LTN20069

LTN20069

HEAT SINK BGA/PGA 16.5X16.5X8.9

Prices and stock are confirmed with the supplier at the moment you ask, so what you see is what you pay.

Product Details

TypeBoard Level
ShapeSquare, Fins
Width0.653" (16.59mm)
Length0.650" (16.51mm)
SeriesPenguin
PackageBulk
MaterialAluminum
Fin Height0.350" (8.89mm)
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Product StatusActive
Material FinishBlack Anodized
Attachment MethodThermal Tape, Adhesive (Included)
Quantity Available22,317 In Stock
Thermal Resistance @ Forced Air Flow8.00Β°C/W @ 500 LFM