Boyd Laconia, LLC
Boyd Laconia, LLC 374624B00000G
374624B00000G
BGA HEAT SINK
Prices and stock are confirmed with the supplier at the moment you ask, so what you see is what you pay.
Product Details
| Package | Bulk |
|---|---|
| Material | Aluminum |
| Fin Height | 0.394" (10.00mm) |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Quantity Available | 0 In Stock Check Lead Time |
| Thermal Resistance @ Natural | 23.40°C/W |
| Power Dissipation @ Temperature Rise | 2.0W @ 50°C |
| Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 300 LFM |