Boyd Laconia, LLC 335224B00034G

335224B00034G

BGA HEAT SINK

Prices and stock are confirmed with the supplier at the moment you ask, so what you see is what you pay.

Product Details

Package	Bulk
Material	Aluminum
Fin Height	0.390" (9.91mm)
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Thermal Tape, Adhesive (Included)
Quantity Available	0 In Stock Check Lead Time
Thermal Resistance @ Natural	34.00°C/W
Power Dissipation @ Temperature Rise	2.0W @ 70°C
Thermal Resistance @ Forced Air Flow	8.00°C/W @ 350 LFM