Boyd Laconia, LLC 2292BG

2292BG

BOARD LEVEL HEAT SINK

Prices and stock are confirmed with the supplier at the moment you ask, so what you see is what you pay.

Product Details

Type	Board Level
Shape	Cylindrical
Package	Bulk
Diameter	0.300" (7.62mm) ID, 1.125" (28.57mm) OD
Material	Aluminum
Package Cooled	BGA
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Thermal Tape, Adhesive (Not Included)
Quantity Available	0 In Stock Check Lead Time
Power Dissipation @ Temperature Rise	1.5W @ 40°C
Thermal Resistance @ Forced Air Flow	8.00°C/W @ 400 LFM