Boyd Laconia, LLC
Boyd Laconia, LLC 374324B60023G
374324B60023G
BGA HEAT SINK
Prices and stock are confirmed with the supplier at the moment you ask, so what you see is what you pay.
Product Details
| Type | Board Level |
|---|---|
| Shape | Square, Pin Fins |
| Width | 1.063" (27.00mm) |
| Length | 1.063" (27.00mm) |
| Series | 37432 |
| Package | Bulk |
| Material | Aluminum |
| Fin Height | 0.394" (10.00mm) |
| Package Cooled | BGA, FPGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Solder Anchor |
| Quantity Available | 1,965 In Stock |
| Thermal Resistance @ Natural | 30.60°C/W |
| Power Dissipation @ Temperature Rise | 1.5W @ 50°C |
| Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 500 LFM |