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Chip Quik Inc.

Chip Quik Inc. SMDSWLF.006 5G

SMDSWLF.006 5G

SOLDER WIRE SN96.5/AG3/CU0.5

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Product Details

FormSpool, 0.176 oz (5g)
TypeWire Solder
PackageBulk
ProcessLead Free
Diameter0.006" (0.15mm)
Flux TypeNo-Clean, Water Soluble
CompositionSn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point423 ~ 428°F (217 ~ 220°C)
Product StatusActive
Quantity Available9 In Stock