Chip Quik Inc.
Chip Quik Inc. TS991SNL500T3
TS991SNL500T3
SOLDER PASTE THERMALLY STABLE NC
Prices and stock are confirmed with the supplier at the moment you ask, so what you see is what you pay.
Product Details
| Form | Jar, 17.64 oz (500g) |
|---|---|
| Type | Solder Paste |
| Series | CHIPQUIK® |
| Package | Bulk |
| Process | Lead Free |
| Flux Type | No-Clean |
| Mesh Type | 3 |
| Shelf Life | 12 Months |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Melting Point | 423°F (217°C) |
| Product Status | Active |
| Shelf Life Start | Date of Manufacture |
| Quantity Available | 0 In Stock Check Lead Time |